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Gigabyte B660M GAMING X AX DDR4 (rev. 1.x) Motherboard

SKU: B660M G X AX DDR4
  • Supports 12th Gen Intel® Core™ Series Processors​​
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs​​
  • 8+1+1 Hybrid Digital VRM Design with DrMOS*​​
  • Fully Covered Thermal Design with High Coverage VRM Heatsinks​
  • WIFI 6 802.11ax 2T2R & BT5 with AERO Antenna​
  • Fast 2.5 GbE GAMING LAN with Bandwidth Management​​
  • Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard
  • USB 3.2 Gen1 Type-C® for Fast and Versatile Connections​
  • Pre-installed IO Shield for easy and quick installation​
  • High Quality Audio Capacitors and Audio Noise Guard​

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  • Warranty 2 year

Description

Specifications

CPU
LGA1700 socket: Support for 12th Generation Intel ® Core™, Pentium ® Gold and Celeron ® Processors* L3 cache varies with CPU * Please refer to “CPU Support List” for more information.
Chipset
Intel ® B660 Express Chipset
Memory
Support for DDR4 4400(O.C.)/ 4300(O.C.)/4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) /3200/3000/2933/2666/2400/2133 MHz memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer “Memory Support List” for more information.)
Onboard Graphics
Integrated Graphics Processor-Intel ® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3. ** Support native HDMI 2.1 TMDS compatible ports. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3 (Graphics specifications may vary depending on CPU support.)
Audio
Realtek ® Audio CODEC High Definition Audio 2/4/5.1/7.1-channel * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE’s website for details on configuring the audio software. Support for S/PDIF Out
LAN
2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless Communication module
Intel ® Wi-Fi 6 AX200 (For PCB rev. 1.0) WIFI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate Intel ® Wi-Fi 6E AX211 (For PCB rev. 1.1) WIFI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate * Actual data rate may vary depending on environment and equipment.
Expansion Slots
1 x PCI Express x16 slot, running at x16 (PCIEX16) * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot. (The PCIEX16 slot conforms to PCI Express 4.0 standard.) 1 x PCI Express x16 slot, running at x4 (PCIEX4) (The PCIEX4 slot conforms to PCI Express 3.0 standard.)
Multi-Graphics Technology
Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies
Storage Interface
CPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB) 4 x SATA 6Gb/s connectors Support for RAID 0, RAID 1, RAID 5, and RAID 10 Intel ® Optane™ Memory Ready * System acceleration with Intel ® Optane™ Memory can only be enabled on the M.2 connectors supported by the Chipset.
USB
Chipset: 1 x USB Type-C ® port with USB 3.2 Gen 2 support, available through the internal USB header 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 1 x USB 2.0/1.1 port on the back panel Chipset+2 USB 2.0 Hubs: 8 x USB 2.0/1.1 ports (4 ports on the back panel, 4 ports available through the internal USB headers)
Internal I/O Connectors
1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 2 x addressable LED strip headers 2 x RGB LED strip headers 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C ® header, with USB 3.2 Gen 2 support 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x S/PDIF Out header 2 x Thunderbolt™ add-in card connectors 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x serial port header 1 x reset button 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper ＊All fan headers are subject to support AIO_Pump, Pump and high performance fan with the capability of delivering up to 2A/12V @ 24W.
Back Panel Connectors
3 x USB 3.2 Gen 1 ports 5 x USB 2.0/1.1 ports 2 x SMA antenna connectors (2T2R) 1 x HDMI 2.1 port 1 x DisplayPort 1 x RJ-45 port 3 x audio jacks
I/O Controller
iTE ® I/O Controller Chip
H/W Monitoring
Voltage detection Temperature detection Fan speed detection Fan fail warning Fan speed control * Whether the fan speed control function is supported will depend on the fan you install.
BIOS
1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for APP Center * Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. @BIOS EasyTune Fast Boot Game Boost ON/OFF Charge RGB Fusion Smart Backup System Information Viewer Support for Q-Flash Plus Support for Q-Flash Support for Xpress Install
Bundled Software
Norton ® Internet Security (OEM version) LAN bandwidth management software
Operating System
Support for Windows 11 64-bit Support for Windows 10 64-bit
Form Factor
Micro ATX Form Factor; 24.4cm x 24.4cm

 

Intel® B660 GAMING Motherboard with 8+1+1 Phases Hybrid Digital VRM Design*, Fully Covered Thermal Design, 2 x PCIe 4.0 M.2 with Thermal Guard, 2.5GbE Gaming LAN, WIFI 6 802.11ax ​, Front USB 3.2 Gen 2 Type-C®, RGB FUSION 2.0, Q-Flash Plus​​
  • Supports 12th Gen Intel® Core™ Series Processors​​
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs​​
  • 8+1+1 Hybrid Digital VRM Design with DrMOS*​​
  • Fully Covered Thermal Design with High Coverage VRM Heatsinks​
  • WIFI 6 802.11ax 2T2R & BT5 with AERO Antenna​
  • Fast 2.5 GbE GAMING LAN with Bandwidth Management​​
  • Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard
  • USB 3.2 Gen1 Type-C® for Fast and Versatile Connections​
  • Pre-installed IO Shield for easy and quick installation​
  • High Quality Audio Capacitors and Audio Noise Guard​
  • RGB FUSION 2.0 supports Addressable LED & RGB LED Strips​​
  • Smart Fan 6 Features Multiple Temperature Sensors , Hybrid Fan Headers with FAN STOP​​
  • Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card​​

 

UNPARALLELED PERFORMANCE

With technology moving so fast, GIGABYTE still keep up with the latest trends and provide our customers with advanced features and latest technology. GIAGBYTE B660 Series motherboards come with upgraded power solution, latest storage standards and outstanding connectivity to enable optimize performance for gaming.
Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.
  1. 8+1+1 Phases DrMOS*
  2. Solid capacitors to improve transient response and minimize oscillation
  3. 8-pin Solid Pin CPU Power Connector

 

GIGABYTE B660 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.

 

Support for DDR4 XMP Up to 4400MHz and Beyond*

GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 4400MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE otherboard.

Hybrid Cores Optimization

With new Intel Hybrid technology, GIGABYTE exclusively creates two new ” CPU Upgrade ” in BIOS profiles to meet different users’ scenarios by adjusting P-Core and E-Core activation and voltage policy.
2X Large Surface
Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.
Real One-piece Build
TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.
Multi-Cut Design
TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

3% Cooler by implementing

2x copper PCB Design

By adopting 2x copper on PCB inner layer, it lowers the components’ temperature at least 3% by turning the PCB into a super thin PCB size copper heatsink to dissipate the heat from the components effectively, due to it’s high thermal conductivity and lower impedance.

Cooling Features

  • High Current Support

    Each fan headers support PWM and DC fan and Water cooling Pump , and up to 24W (12V x 2A) with Over-Current Protection

  • Precision Control

    Up to 6 temperature/fan speed control points for precise fan curve

  • Dual Curve Mode

    Slope/Stair dual mode for different user scenario

  • Fan Stop

    Fan can stop completely below users’ specified temperature point

 

NEXT GENERATION CONNECTIVITY

GIGABYTE B660 Series Motherboards let you experience ultimate connection flexibility and blazing data-transfer speed with next generation network, storage, and WIFI connectivity.

First adopter on 2.5 GbE LAN onboard

2X Faster than ever
    1. Adoption of 2.5G LAN provide up to 2.5 GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.
    2. Support Multi-Gig(10/100/1000/2500Mbps) RJ-45 Ethernet

802.11ax WIFI 6

Latest Wireless solution 802.11ax WIFI 6 with new dedicated 6GHz band, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

Benefit of WIFI 6

  1. Dedicated spectrum in 6GHz band for less interference
  2. 5.5X throughput than 802.11ac 1×1*
  3. 4X better network capacity, no traffic jams especially in those dense area with lots of devices
  4. Network efficiency increase for better user experience

 

 

Connecting the Future – USB Type-C® The World’s Next Universal Connector

The USB Type-C® is a new reversible connector that is loaded with useful features such as USB 3.2 Gen 2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen 2 controller, this little port provides the best USB Type-C® experience possible.
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.

DEFINITIVE AESTHETICS

GIGABYTE motherboards bundle several useful and intuitive software to help users to control every aspect of motherboard and provide customizable lighting effect with outstanding aesthetics to fit your unique personality.

RGB FUSION 2.0

B660 motherboards feature RGB FUSION 2.0 to offer lighting effected options and customized settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC.
New User Interface

All new EASY MODE shows important hardware information in one page including CPU clock, Memory, Storage, Fan.

My Favorites

Add constantly used items into the favorite menu for quick access.

Storage Information

Show all kinds of storage information including SATA, PCIE and M.2 interface.

Changelog

List all changes before saving and exiting bios. Quickly review overall settings modification.

Intuitive Load Line Curve

Clearly show each loadline calibration setting in an intuitive curve graph.

EasyTune™

GIGABYTE’s EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment. With Smart Quick Boost, one click is all it takes to automatically overclock your system, giving an added performance boost when you need it the most.

System Information Viewer

GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system’s behavior; these are the possibilities of the System Information Viewer.

Q-Flash Plus

Update the BIOS easily without installing the CPU, memory and graphics card.
With GIGABYTE Q-Flash Plus, you don’t need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you’re good to go!

Solid Pin Power Connectors

B660 motherboards feature solid plated ATX 12V 8 pin power connectors to offer a stable power supply during CPU overloading.

Solid Pin Power connector advantages

  1. Larger contact area for electricity
  2. More metal quantity to sustain higher power and generated heat
  3. Ultra durable and longer lifespan

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