- Pick up from the MTC KSA Office
To pick up from our Jeddah or Riyadh office
Free
- Courier delivery
Courier will deliver to the specified address
Call or email for more information about shipping charges and arrange courier from our team, Thanks
599 ر.س
To pick up from our Jeddah or Riyadh office
Free
Courier will deliver to the specified address
Call or email for more information about shipping charges and arrange courier from our team, Thanks
Ultra Durable PCIe Armor
AMP-UP Audio
RGB FUSION 2.0
10+2 Phases Digital Twin Power Design with DrMOS
Advanced Thermal Design
Solid Pin Power Connectors
Dual M.2 Connectors
1. 22110 M.2 with Thermal Guard
2. 2280 M.2
Smart Fan 5 + FAN STOP
GIGABYTE B550 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.
• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors
B550M AORUS PRO-P motherboard uses a 10+2 phases Digital Twin Power Design which includes PWM controller, DrMOS and Ferrite core choke as high quality selected components. These 100% digital controller offer incredible precision in delivering power to the motherboard’s most power-hungry and energy-sensitive components, allowing enthusiasts to get the absolute maximum performance from 3rd Gen AMD Ryzen™ processors.
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With the optimized daisy-chain routing, the B550 motherboard provides a proven speed of DDR4-4000MHz and beyond with high density memory modules*. Optimized daisy-chained routing eliminates the stub effect, pushes the one DIMM per channel in dual channel interleaving mode to hit higher memory frequencies, providing professional gamers a denser and faster system memory experience.
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(Please refer “CPU Support List” for more information.)
(Please refer “Memory Support List” for more information.)
Integrated in the 3rd Generation AMD Ryzen™ with Radeon™ Graphics processors:
Maximum shared memory of 16 GB
1 x PCI Express x16 slot (PCIEX16), integrated in the CPU:
1 x PCI Express x16 slot (PCIEX4), integrated in the Chipset:
1 x PCI Express x1 slot (PCIEX1), integrated in the Chipset:
1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 2242/2260/2280/22110 SSDs:
1 x M.2 connector (M2B_SB), integrated in the Chipset, supporting Socket 3, M key, type 2242/2260/2280 SSDs:
4 x SATA 6Gb/s connectors, integrated in the Chipset:
CPU:
Chipset:
Chipset+1 USB 2.0 Hub:
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