Dahua SSD-E900N128G NVMe M.2 128G Solid State Drive
SKU:
DHI-SSD-E900N128G
- Capacity: 128 GB
- Form Factor M.2 2280
- Port PCIe Gen 3.0 x 4
- Net Weight Max 8 g (0.02 lb)
- Sequential Read 3 Up to 2000 MB/s
- Sequential Write 3 Up to 1600 MB/s
- 4K Random Read 3 Up to 230000
- 4K Random Write 3 Up to 230000
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- Warranty 2 year
Description
Specifications
Product Model | DHI-SSD-E900N128G |
Capacity | 128 GB |
Form Factor | M.2 2280 |
Port | PCIe Gen 3.0 x 4 |
Net Weight | Max 8 g (0.02 lb) |
Product Dimensions 2 |
80.0 mm × 23.0 mm × 4.8 mm (3.15″ × 0.91″ × 0.19″)
|
Packaging Dimensions |
140.5 mm × 105.5 mm × 15.5 mm (5.53″ × 4.15″ × 0.61″)
|
Memory Component | 3D NAND |
Power Consumption 2 |
3696 mW (max) 1188 mW (idle)
|
S.M.A.R.T | Support |
TRIM | Support |
Garbage Collection | Support |
Sequential Read 3 | Up to 2000 MB/s |
Sequential Write 3 | Up to 1600 MB/s |
4K Random Read 3 | Up to 230000 |
4K Random Write 3 | Up to 230000 |
MTBF | 1,500,000 hours |
Operating Temperature |
0°C to +70°C (+32°F to +158°F)
|
Storage Temperature |
–40°C to +85°C (–40°F to +185°F)
|
Operating Humidity | 5%–95% (non-condensing) |
Vibration Resistance | 10–200 Hz, 0.5 G |
Shock Resistance | 1500 G/0.5 ms (half sine wave) |
TBW | 512 TB |
Features
- Adopts high-quality 3D NAND wafer level chip
- Supports PCIe3.0 x4, and NVMe 1.3 protocol
- All-metal cooling plate is included; equipped with intelligent temperature control technology
- Supports TRIM to improve read/write performance and speed
- Supports Max. Write technology for full-disk SLC cache
- Supports LDPC ECC
- Low power consumption management
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